Published on Apr 02, 2024
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3D ICs
Introduction
==> 3-D ICs are an attractive chip architecture that can alleviate the interconnect related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip ( SoC ).
==> The multi-layer chip industry opens up a whole new world of design.
==> With the Introduction of 3-D ICs, the world of chips may never look the same again
==> In the 3-Ddesign architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.
Motivation for 3-D ICs
==> Interconnect limited VLSI performance
==> Physical limitations of cu interconnects
==> System – on – a – chip design
3D Architecture
--> Figure
Advantages of 3D architecture
==>Small size, weight and cost.
==>High reliability.
==>Low power consumption
==>Improved performance
==>Fast operation
Limitations
==> Functions at fairly low voltage
==> Limited power dissipation
==> Difficult to achieve low noise and high voltage operation
==> Poor high frequency performance
Area and performance estimation of 3D ICs
==> Rent’s Rule
T=kNP -------------(i)
==> 2-D and 3-D Wire-length distributions
I(l)= i(x)dx -----------(ii)
==> Estimating 2-D and 3-D chip area
Arequired = √Ac (PlocLtotal_loc+PsemiLtotal_semi+PglobLtotal_glob)/N
Silicon Epitaxial Growth
==> Figure
Conclusion
==> The 3 D memory will just the first of a new generation of dense, inexpensive chips that promise to make digital recording media both cheap and convenient enough to replace the photographic film and audio tape.
==> We can understand that 3-D ICs are an attractive chip architecture, that can alleviate the interconnect related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip.
==> The multilayer chip building technology opens up a whole new world of design like a city skyline transformed by skyscrapers
References
==> www.seminarsonly.com
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